Podcast EP335: The Far Reaching Impact of UCIe with Dr. Debendra Das Sharma
SemiWiki.com
- Published
- March 13, 2026
- Duration
- 32:18
- Summary source
- description
- Last updated
- Apr 29, 2026
Discusses artificial-intelligence.
Summary
Daniel is joined by Dr. Debendra Das Sharma, a Senior Fellow and Chief I/O architect in the Data Platforms and Artificial Intelligence Group at Intel. He is a member of the National Academy of Engineering (NAE), Fellow of IEEE, and Fellow of International Academy of AI Sciences. He is a leading expert on I/O subsystem and interface… Read More
Intel's Dr. Devendra Das Sharma, co-inventor of the UCIE chiplet interconnect standard, breaks down how the open ecosystem is evolving from planar 2D connections to 3D stacking and rack-level composable AI systems.
Key takeaways
- UCIe has rapidly evolved from planar 2D/2.5D chiplet connectivity (v1.0) to vertical 3D stacking and doubled bandwidth density (v3.0), maintaining full backwards compatibility throughout all generations.
- UCIe 2.0 introduced holistic chiplet manageability—addressing firmware download, field testing, debug, and repair challenges that arise when chiplets cannot be directly probed after packaging.
- Real-world adoption is accelerating: 97% of surveyed designs use UCIe (39% advanced packaging, 58% standard), with server/AI applications representing 53% of usage and 140+ consortium members spanning foundries, cloud providers, automotive, and networking.
Why this matters
UCIe is establishing itself as the PCI Express-equivalent open standard for chiplet interconnects, enabling a composable, multi-vendor chiplet ecosystem that is critical for scaling AI, HPC, and automotive compute performance beyond monolithic die limitations.
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Show notes
Daniel is joined by Dr. Debendra Das Sharma, a Senior Fellow and Chief I/O architect in the Data Platforms and Artificial Intelligence Group at Intel. He is a member of the National Academy of Engineering (NAE), Fellow of IEEE, and Fellow of International Academy of AI Sciences. He is a leading expert on I/O subsystem and interface… Read More
Themes
- artificial-intelligence