Results for "3D chiplet stacking"

Episodes

• 

  📋Intelligent report

  Podcast EP335: The Far Reaching Impact of UCIe with Dr. Debendra Das Sharma

  SemiWiki.com· Mar 13, 2026

  Intel's Dr. Devendra Das Sharma, co-inventor of the UCIE chiplet interconnect standard, breaks down how the open ecosystem is evolving from planar 2D connections to 3D stacking and rack-level composable AI systems.

  Devendra Das SharmaUCIe (Universal Chiplet Interconnect Express)IntelPCI ExpressCXL (Compute Express Link)

  artificial-intelligence